The next part of the PCB Design Flow Process starts on the layout until design completion for board fabrication.
15. PREPARE LAYOUT FOR TRACE ROUTING
15. PREPARE LAYOUT FOR TRACE ROUTING
Compare
Schematic CAE net list with the PCB Design net list using Netcheck Tools.
16. SETUP
DESIGN RULES
Setup/Design
Rules on “Default Clearance” rules and …
Setup/Design
Rules on “Net Clearance” rules are to be set up for Voltage, Ground and
Critical Nets.
Set
class rules for high-speed technology.
17. MANUAL ROUTING
Manually
Bus route memory sections using Copy/Paste command.
Manually
fan out all Voltages that connect to an inner layer plane using Via Share
technique.
Manually
fan out all Ground connections so that every Ground Pin gets its own Via.
Manually
route all other Voltages that require large trace widths.
Manually
route all high-speed matched length traces and critical nets.
Use
Tools/Verify Design/Check Planes to insure 100% fan out of all SMT Plane Pins.
Use
Tools/Verify Design/Check Clearances to insure no short circuits.
If
the design is a 2-Layer board, all voltages should be manually routed per
Engineers specification.
18. Second (2nd) SET
OF QUALITY PRINTS
PCB
Designer will print all layers that were affected by manual routing and give them to the engineer.
If
the placement or pad-stacks have changed run check prints of assembly &
drill drawing
19. SIGNAL
INTEGRITY OUTPUT
Generate
a Hyperlynx file for signal analysis.
20. FIX ENGINEERS RED-LINED PRINTS
Incorporate
all of the Project Engineers corrections
If
there were many corrections, PCB Designer will create a new set of check
prints.
21. TESTABILITY
The
Project Engineer will be responsible for informing the PCB Designer the
Testability Rules, early in the Process.
This includes the following questions:
Does every Net need a test
point or just some of the nets?
Do voltage nets require
extra test points?
Do non-connected pins need
to be testable?
Will the Project Engineer
add selective test points to the schematic?
Can vias be used as test
points, or do they have to be “Bottom Side” non-drilled Pads?
What size do the test points
have to be, what is the point to point spacing requirements & amount of
pins per square inch?
Are there vacuum
requirements for the test fixture?
If
PCB Design requires testability on every net, the PCB Designer will add a test
point for every net, using PADS DFT Audit program and place the test points,
near one of the pins, of the net it belongs to.
22. ROUTE REMAINDER OF NON-CRITICAL ROUTES
If
the PC Board has a large number of production boards made, it should be 100 %
manually routed to reduce trace length, reduce via count and reduce layers.
If
Project Engineer requested a quick turn proto-type, use an auto router to route
remainder of board.
If
auto routing is used, clean up the traces on all layers after the auto router
has completed 100%
Make
and save a pre-auto routed version of the PCB.
This will be use for future revisions.
23. FINAL
DRC CHECKS
PCB
Designer & Project Engineer: Tools/Verify Design – Check Clearances,
Continuity and Panes.
24. SILKSCREEN
Create
Silkscreen (use 0.05mm snap grid) and bottom side etch text.
All
reference designators must be moved outside component, and must not exceed two
different rotations. All company identification & REV Blocks must be placed
inside the board outline. Default text height/width is .080”/.008” Minimum
height/width is .060”/.006”.
All
connectors should have text to identify the end-pins. Add connector &
jumper text names, if any.
25. Third (3rd) SET OF QUALITY PRINTS
Create
check prints of all Routed Layers, Silk-screens, Solder Masks & Paste
Masks.
Create
check prints of final AutoCAD Drill & Assembly Drawings.
Check
final CAE Netlist with final CAD Netlist.
26. FINAL CAM OUTPUT
Make
final prints of AutoCAD Assembly & Drill Drawings.
Create
Fabrication Data that contains Gerber Data, Drill Data & Fabrication
Drawing.
Import
the PADS ASCII file into CAM350 to extract an IPC-D-356 Netlist.
Create
Assembly X/Y Coordinate Data.
Save
all of the final output data to Source Safe.
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