PCB Fab and Assembly -- http://www.bittele.com/ -- PCB Fab and Assembly

Saturday, June 30, 2012

PADS Layering Scheme


LAYER               USAGE

1-18                      Trace & Plane Layers (Copper Layers)

19                         Targets, Gerber Data Title block, .004” Board Outline

20                         Component Placement Courtyards (outline)

21                         Solder Mask Top

22                         Paste Mask Bottom

23                         Paste Mask Top

24                         Drill Drawing

25                         Plane Layer Clearances, Thermal Relief’s, .100” Board
                             Outline, Common Split Planes & Common Plane Voids

26                         Silkscreen Top

27                         Assembly Drawing Top

28                         Solder Mask Bottom

29                         Silkscreen Bottom

30                         Assembly Drawing Bottom

No comments:

Post a Comment